XC3S700A-4FTG256C
XC3S700A-4FTG256C
Active
Description:  IC FPGA 161 I/O 256FTBGA
Manufacturer:  Xilinx
History Price: $87.71000
In Stock: 16900
XC3S700A-4FTG256C Specification
Specification
Part No
XC3S700A-4FTG256C
Category
Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer
Xilinx
Series
Spartan-3A
Packaging
Tray
Status
Active
Environmental Compliance
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
HS Code
-
Technical Parameter
Programmable
Not Verified
Number of LABs/CLBs
1472
Number of Logic Elements/Cells
13248
Total RAM Bits
368640
Number of I/O
161
Number of Gates
700000
Voltage - Supply
1.14V ~ 1.26V
Mounting Type
Surface Mount
Operating Temperature
0 ℃ ~ 85 ℃ (TJ)
Package / Case
256-LBGA
Supplier Device Package
256-FTBGA (17x17)
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XC3S700A-4FTG256C Description
The Xilinx XC3S700A-4FTG256C is a member of the Spartan-3A family of FPGAs (Field Programmable Gate Arrays), which are designed to provide a cost-effective solution for a wide range of applications, including consumer electronics, automotive, industrial automation, and communications. The Spartan-3A series is known for its low power consumption, high performance, and ease of use, making it an ideal choice for designers looking to implement flexible and efficient digital logic solutions. Below is a detailed introduction to the XC3S700A-4FTG256C, including its specifications and parameters.

## Overview

The XC3S700A-4FTG256C FPGA is designed to deliver a balance of performance and power efficiency, making it suitable for applications that require moderate logic density and high-speed processing. The Spartan-3A architecture is optimized for low power consumption while providing sufficient resources for implementing complex designs.

## Key Specifications

1. Device Type: FPGA (Field Programmable Gate Array)
2. Family: Spartan-3A
3. Package Type: FTG256 (Fine Pitch Ball Grid Array)
4. Logic Cells: Approximately 700,000 logic cells, providing ample resources for implementing a variety of digital logic functions.
5. Configurable Logic Blocks (CLBs): The device contains a significant number of CLBs, which are the fundamental building blocks for implementing digital logic.
6. DSP Slices: The XC3S700A includes DSP slices optimized for high-performance digital signal processing applications, making it suitable for tasks such as filtering, FFTs, and other mathematical computations.
7. Block RAM: The FPGA features multiple Block RAM (BRAM) resources, providing on-chip memory for data storage and buffering.
8. I/O Pins: The XC3S700A-4FTG256C supports up to 232 I/O pins, allowing for various I/O standards and easy interfacing with other components.
9. Maximum Operating Frequency: The maximum clock frequency can reach up to 200 MHz, depending on the design and configuration.
10. Power Supply Voltage: The typical operating voltage is 1.2V for the core and 3.3V for I/O, depending on the specific I/O standard used.
11. Power Consumption: The device is designed for low power consumption, making it suitable for battery-operated and energy-sensitive applications.
12. Temperature Range: The XC3S700A-4FTG256C is available in various temperature grades, including commercial and industrial ranges, ensuring reliability in different environmental conditions.

## Features

- Low Power Consumption: The Spartan-3A architecture is optimized for low power, making it ideal for applications where energy efficiency is critical.
- Flexible I/O Options: The device supports multiple I/O standards, including LVTTL, LVCMOS, and others, allowing for compatibility with a wide range of peripherals and interfaces.
- High-Speed Connectivity: The XC3S700A supports high-speed interfaces, facilitating fast data transfer and communication with other devices.
- Development Tools: Xilinx provides a comprehensive suite of development tools, including the ISE Design Suite, which supports design entry, synthesis, and implementation for the XC3S700A-4FTG256C.

## Applications

The XC3S700A-4FTG256C is suitable for a variety of applications, including but not limited to:

- Consumer Electronics: Ideal for applications such as video processing, image processing, and audio processing in consumer devices.
- Industrial Automation: Used in machine control, data acquisition, and process monitoring applications.
- Automotive: Employed in automotive control systems, infotainment, and advanced driver-assistance systems (ADAS).
- Communications: Suitable for networking equipment, wireless communication systems, and signal processing applications.

## Conclusion

The Xilinx XC3S700A-4FTG256C FPGA is a versatile and powerful device that offers a combination of high performance, low power consumption, and flexibility. Its specifications make it an excellent choice for a wide range of applications across various industries. With the support of Xilinx%27s development tools, designers can efficiently implement complex systems that leverage the FPGA%27s capabilities, enabling innovative solutions to meet modern challenges. The Spartan-3A family, including the XC3S700A-4FTG256C, continues to be a popular choice for engineers looking to create efficient and effective digital designs.
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  • Customer Reviews
    4.95 out of 5.00 stars from 125 customer reviews from all over the world
    Riccardo Longo
    Italy
    5 stars
    2026-03-24 15:29
    tested one by one.
    Gustavo Henrique Silva
    Brazil
    5 stars
    2026-03-24 11:43
    Very, very well packed
    Ulysses Santos Almeida
    Brazil
    5 stars
    2026-03-22 23:32
    All very well. The purchase arrived quickly. Great supplier.
    Christine Henderson
    United States
    5 stars
    2026-03-22 20:43
    Rds(on) is according to datasheets
    Darius Kęstutis
    Lithuania
    5 stars
    2026-03-22 18:19
    everything working, very fast shipping
    Susanne Bauer
    Germany
    5 stars
    2026-03-22 15:59
    Everything was fine. I would buy aigen in this shop.