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MPFS095T-1FCSG536E
MPFS095T-1FCSG536E
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Description:  MPFS095T-1FCSG536E
Manufacturer:  Microchip Technology
History Price: $283.87000
In Stock: 12120
MPFS095T-1FCSG536E Specification
Specification
Part No
MPFS095T-1FCSG536E
Category
Embedded - System On Chip (SoC)
Manufacturer
Microchip Technology
Series
PolarFire
Packaging
Tray
Status
Active
Environmental Compliance
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
HS Code
-
Technical Parameter
Architecture
MPU, FPGA
Core Processor
RISC-V
Flash Size
128kB
RAM Size
857.6kB
Peripherals
DMA, PCI, PWM
Connectivity
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed
-
Primary Attributes
FPGA - 93K Logic Modules
Operating Temperature
0 ℃ ~ 100 ℃
Package / Case
536-BGA
Supplier Device Package
536-LFBGA
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MPFS095T-1FCSG536E Description
Microchip MPFS095T-1FCSG536E is a member of the PolarFire® SoC FPGA family that combines a multi-core 64-bit RISC-V processor subsystem with a non-volatile FPGA fabric in a single monolithic device. It is designed for embedded systems that require a combination of software programmability, deterministic real-time processing, hardware acceleration, high integration, and low power consumption. The device enables the implementation of heterogeneous computing architectures where operating systems, application software, and custom hardware accelerators coexist within a unified platform.

## Device Function and Product Positioning

The MPFS095T-1FCSG536E belongs to the System-on-Chip FPGA (SoC FPGA) category. Unlike traditional FPGAs that rely entirely on programmable logic, or standalone microprocessors that execute software only, this device integrates both programmable logic resources and a dedicated processor subsystem.

Within the PolarFire SoC family, the MPFS095T device represents a mid-density FPGA offering. It provides a balance between logic capacity, processing performance, memory resources, and power efficiency. The architecture is intended for applications requiring embedded Linux capability, real-time control, industrial networking, communication processing, edge computing, and hardware acceleration.

The suffix interpretation is as follows:

* MPFS095T: PolarFire SoC FPGA with approximately 95K-class logic density.
* -1: Speed grade.
* FCSG536: 536-ball Fine-Pitch Chip Scale Grid Array package.
* E: Industrial-grade device variant.

## Processor Subsystem Architecture

A major feature of the MPFS095T-1FCSG536E is its integrated RISC-V processing subsystem.

The processor cluster contains:

* One RV64IMAC monitor core.
* Four RV64GC application cores.

This architecture provides a total of five 64-bit RISC-V processor cores. The monitor core is responsible for system management and boot functions, while the four application cores are intended for operating systems and application workloads.

The processor subsystem supports:

* Symmetric and asymmetric multiprocessing.
* Linux operating systems.
* Real-time operating systems.
* Bare-metal software environments.
* Hardware/software partitioned system architectures.

The application cores operate at frequencies up to 667 MHz, enabling substantial embedded computing performance while maintaining deterministic behavior required in industrial and communication systems.

## FPGA Fabric Architecture

The FPGA portion of the device is based on Microchip's PolarFire architecture.

The MPFS095T device provides approximately:

* 95K logic element class capacity.
* About 93K effective logic elements available to the user design.
* Dedicated arithmetic and DSP resources.
* Embedded SRAM blocks.
* User programmable ROM resources.
* Integrated clock management resources.

The FPGA fabric allows implementation of:

* Digital signal processing functions.
* Protocol processing engines.
* Custom communication interfaces.
* Embedded hardware accelerators.
* Machine vision processing pipelines.
* AI inference acceleration.
* Industrial control logic.

The non-volatile FPGA architecture also eliminates the requirement for an external configuration memory device.

## Confirmed Device Parameters

The following specifications are associated with the MPFS095T-1FCSG536E device.

| Parameter | Specification |
| ---------------------------------- | -------------------------------- |
| Device Family | PolarFire SoC FPGA |
| Processor Architecture | 64-bit RISC-V |
| Monitor Core | 1 × RV64IMAC |
| Application Cores | 4 × RV64GC |
| Total CPU Cores | 5 |
| Maximum CPU Frequency | Up to 667 MHz |
| FPGA Logic Density | Approximately 93K logic elements |
| Embedded Nonvolatile Memory (eNVM) | 128 KB |
| System Nonvolatile Memory (sNVM) | 56 KB |
| Processor Subsystem SRAM | 857.6 KB |
| Embedded FPGA RAM | Approximately 6.7 Mbits |
| DSP Blocks | 292 dedicated MACC blocks |
| Package Type | FCSG536 |
| Package Style | Fine-Pitch BGA |
| Ball Count | 536 |
| Package Size | 16 mm × 16 mm |
| FPGA I/O Count | 276 |
| Processor I/O Count | 136 |
| Temperature Range | Industrial grade |

## Memory Architecture

The MPFS095T-1FCSG536E incorporates several memory technologies to support processor and FPGA workloads.

The processor subsystem includes:

* Embedded SRAM resources.
* Embedded nonvolatile memory.
* Secure nonvolatile storage.

The FPGA fabric contains:

* Large SRAM block resources.
* Distributed memory structures.
* User ROM capability.

The device also supports external DDR memory interfaces through an integrated memory controller architecture.

Supported memory technologies include:

* DDR4 SDRAM.
* DDR3 SDRAM.
* LPDDR4.
* LPDDR3.

The memory subsystem includes error correction capabilities that improve data integrity in reliability-sensitive applications.

## DSP and Signal Processing Resources

The MPFS095T FPGA fabric integrates dedicated digital signal processing resources.

The device contains:

* 292 dedicated multiply-accumulate blocks.
* Hardware arithmetic resources optimized for DSP implementation.
* High-bandwidth internal routing architecture.

These resources enable efficient implementation of:

* FIR filters.
* FFT engines.
* Digital up/down conversion.
* Motor control algorithms.
* Radar signal processing.
* Industrial sensor processing.
* Image and video processing pipelines.

Compared with implementing arithmetic functions entirely in LUT fabric, the dedicated DSP blocks significantly improve computational efficiency and reduce power consumption.

## Clocking and Timing Infrastructure

The device integrates a comprehensive clock management architecture.

Clocking resources include:

* Phase-Locked Loops (PLLs).
* Delay-Locked Loops (DLLs).
* Global clock distribution networks.
* Regional clock resources.

These blocks support:

* Frequency synthesis.
* Clock multiplication.
* Clock division.
* Clock phase alignment.
* Low-skew clock distribution.

The clock architecture is designed to support both processor subsystem requirements and high-performance FPGA logic designs.

## Communication and Peripheral Interfaces

The processor subsystem integrates numerous communication peripherals.

Available interfaces include:

* Gigabit Ethernet.
* USB 2.0 OTG.
* PCI Express Gen2.
* CAN 2.0.
* SPI.
* I²C.
* UART.
* MMC/SD interfaces.
* QSPI interfaces.

The integrated Ethernet controllers support networking applications without requiring external network processing devices.

PCIe capability allows direct connection to host systems, storage devices, and accelerator architectures.

Industrial communication systems can utilize the CAN, SPI, and Ethernet resources for protocol implementation and control applications.

## Security Features

Security is a major design characteristic of the PolarFire SoC architecture.

The device incorporates:

* Secure boot mechanisms.
* Hardware root-of-trust capabilities.
* Nonvolatile secure storage.
* Configuration protection mechanisms.
* Intellectual property protection features.

Because the FPGA technology is non-volatile, the configuration process differs from SRAM-based FPGA architectures and can reduce exposure to configuration-related vulnerabilities.

These security capabilities are particularly valuable in industrial, networking, aerospace, and critical infrastructure applications.

## Package Characteristics

The MPFS095T-1FCSG536E is supplied in a 536-ball Fine-Pitch Chip Scale Grid Array package.

Key package characteristics include:

* 536 solder balls.
* Compact 16 mm × 16 mm footprint.
* High I/O density.
* Suitable thermal performance for high-integration designs.
* Support for complex PCB routing and multilayer board architectures.

The package provides access to both processor subsystem interfaces and FPGA programmable I/O resources.

## Typical Application Scenarios

The MPFS095T-1FCSG536E is commonly deployed in applications where embedded processing and programmable hardware acceleration must coexist.

Typical application areas include:

* Industrial automation controllers.
* Programmable logic controllers.
* Industrial gateways.
* Edge computing platforms.
* Embedded Linux systems.
* Communication infrastructure equipment.
* Network processing platforms.
* Machine vision systems.
* AI inference accelerators.
* Aerospace electronic systems.
* Defense electronics.
* Intelligent instrumentation.
* Robotics control platforms.
* High-performance embedded computing systems.

In these applications, software functions execute on the RISC-V processor subsystem while latency-sensitive or computationally intensive functions are implemented within the FPGA fabric.

## Conclusion

The Microchip MPFS095T-1FCSG536E is a PolarFire SoC FPGA that integrates a five-core 64-bit RISC-V processor subsystem with approximately 93K logic elements of non-volatile FPGA fabric. The device combines embedded processing, programmable hardware acceleration, substantial on-chip memory resources, integrated communication peripherals, dedicated DSP capability, and industrial-grade reliability within a compact 536-ball package. Its architecture is specifically optimized for embedded computing systems that require deterministic operation, low power consumption, high integration, and the flexibility of combining software execution with custom FPGA-based hardware functionality.
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  • Customer Reviews
    4.95 out of 5.00 stars from 88 customer reviews from all over the world
    Andrés López
    Spain
    5 stars
    2026-09-18 10:23
    Well packaged received component. In tests. Thank you
    Felipe Nascimento Filho
    Brazil
    5 stars
    2026-09-18 09:43
    100% I recommend
    Bruno César Nascimento
    Brazil
    5 stars
    2026-09-18 09:42
    Delivered on time Congratulations!!!!!
    Lars de Ruiter
    Netherlands
    5 stars
    2026-09-18 07:56
    Received in good order. Thank you.
    Fábio Henrique
    Brazil
    5 stars
    2026-09-18 07:56
    Excellent Product, delivered super fast and quality, great seller!
    Camila Martins Sr.
    Brazil
    5 stars
    2026-09-18 07:32
    All very fast. Excellent goods